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Intel XDACBL3M Compatible 10G SFP+ Passive Copper Twinax Cable, 3m (10ft)

Intel XDACBL3M Compatible 10G SFP+ Passive Copper Twinax Cable, 3m (10ft)

The XDACBL3M compatible cable combines 10G DAC connectivity with a defined 3m (10ft) pathway between SFP+ to SFP+ interfaces. It is intended for Intel equipment and is documented here as a distinct order code, allowing cable schedules, service access and related length selections to be reviewed before installation.

OEM Part Number: XDACBL3MHT Part Number: XDACBL3M

Product Highlights

  • Compatible alternative to Intel XDACBL3M
  • 10G connectivity at 10Gbps
  • Interface configuration: SFP+ to SFP+
  • Fixed length and part number: 3m (10ft), XDACBL3M
  • Cable construction: Passive Twinax
  • Conductor specification: 30AWG
  • Maximum power consumption: ≤0.1W
  • Minimum bend radius: 23mm

Specifications

HT Part NumberXDACBL3M
Intel CompatibleSFP-H10GB-CU3m
ManufacturerHT
Connector TypeSFP+ to SFP+
Max Data Rate10Gbps
MediaCopper
Power Supply3.3V
Minimum Bend Radius23mm
Wire AWG30AWG
Cable Length3m (9.84ft)
Jacket MaterialPVC (OFNR)
Cable TypePassive Twinax
Temperature0 to 70°C (32 to 158°F)
Power Consumption≤0.1W
Application10G Ethernet
Protocols1x InfiniBand QDR, DDR, SDR, 10 Gigabit Ethernet, Fibre Channel

Power and Thermal Planning

The rated power consumption is ≤0.1W. Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Position Within the Length Range

XDACBL3M occupies the middle of this family between XDACBL2.5M at 2.5m (8ft) and XDACBL4M at 4m (13ft). It adds 0.5m over the shorter option for extra routing clearance, while the next longer version adds another 1m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.

Structured Pathways and Serviceability

Treat the direct-attach assembly as part of the permanent pathway plan even when the link is expected to be temporary. Follow the intended horizontal and vertical managers, maintain the specified bend radius and leave service access around both ports. A small, supported service allowance is preferable to excess slack concealed inside a rack or placed under cable-tie pressure. For this assembly, the listed conductor specification is 30AWG; the minimum bend radius is 23mm; the stated power consumption is ≤0.1W; the jacket material is PVC (OFNR).

Cable Construction and Routing

This assembly uses 30AWG conductors, PVC (OFNR) jacket, minimum bend radius 23mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Network and Protocol Considerations

The intended application is 10G Ethernet. Listed interface and protocol references include 1x InfiniBand QDR, DDR, SDR, 10 Gigabit Ethernet, Fibre Channel. Confirm that the host firmware and port configuration support the same operating mode.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Length Selection and Installation Planning

At 3m (10ft), this assembly can bridge non-aligned ports or adjacent racks while remaining a single direct-attach link. Support longer horizontal runs with suitable cable management and preserve space for cooling and future maintenance.

Ordering Information

Include the part number, fixed length, quantity and required pathway or rack grouping in the order information. The host model and firmware release are useful for change-controlled deployments. Different lengths should remain separate order lines so delivered labels and packing records agree with the pathway plan. Quantity and any labeling instructions should be attached specifically to XDACBL3M.

Intel Compatibility and Factory Testing

Verification covers the physical connectors, expected host identity and an operating link with available diagnostic indications. We distinguish this complete check from a simple continuity test. Platform model and software release can be reviewed in advance where the installation has strict documentation or change-control requirements. The check includes link stability and diagnostic indications, followed by a final inspection of both ends.

Shipping and Lead Time

Available stock is generally dispatched within one to three working days after order confirmation, with production lead times advised for larger quantities. Delivery can be arranged by courier, air freight or sea freight, and goods may instead be handed to an appointed forwarder or shipped on the customer’s courier account.

Quality Assurance and Packaging

After connector inspection and link verification, the assembly is coiled without tight bends and packed with end protection. Labels can cross-reference the customer cable schedule, OEM part number and length. This supports both receiving checks and later moves, adds or changes. Volume orders can include customer references on the labels and carton list.

Frequently Asked Questions

Is this an original Intel cable?

No. It is an HT-manufactured compatible alternative for equipment that specifies Intel XDACBL3M.

How should an unused assembly be stored?

Protect both connector ends, keep the cable in a loose bend-safe coil and retain its part-number label so the length and compatibility identity remain traceable.

Can different brands be connected with the same assembly?

Only where both hosts explicitly support the complete interface and compatibility arrangement. Document each end and select the appropriate brand-specific product when required.

Does this order code cover multiple lengths?

No. XDACBL3M refers here to 3m (10ft). Every other verified length has a separate part number and page in the length list.

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Product Datasheets

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